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WHO'S DOING WHO? OEM NEWS

PRESS RELEASE FROM THT

New Whitepaper: China's Telecom Market: EDGE

24- April 2007-- THT Research today announced the release of its new whitepaper, "China's Telecom Market: EDGE." The 25 page report discusses the emergence of EDGE (2.75 GSM) technologies in China. In particular it focuses on the efforts of China's leading wireless telecom, China Mobile, to build its EDGE network at the same time that it works towards developing a TD-SCDMA 3G network. The whitepaper compares China Mobile's EDGE network to competing networks, outlines its current and planned expansion, services offered, customer base, and competitive position. For more information about this whitepaper or for custom research inquiries related to China telecom, please contact sales@thtresearch.com


COMPANY NEWS AND INDUSTRY TRENDS

Intel to purchase US$65M in Powertech bonds

Intel Corp is planning to invest US$65M in Powertech bonds to improve its flash memory business. If its will push through, Intel will purchase NT$2.11 billion of a total NT$3.5 billion in convertible bonds issued by Powertech that can be converted into shares. The bond purchase is for the expansion of Intel's NAND flash memory business to give it access to components and the supply chain.


Windows Live Toolbar on Lenovo's PCs and laptops

Lenovo has replaced Google applications (Google's browser toolbar, search software, and photo-editing program) and preloaded its PCs and laptops with Windows Live Toolbar instead. With Windows Live Toolbar, users will have one-click access to Live search, can customize their home page content, create multiple pages according to their interests, and add content from multiple sources. Lenovo’s partnership with Microsoft will extend to all its computers, including its ThinkCenter desktops and ThinkPad notebooks.


Intel to expand cooperation with TSMC

Intel Corp. expands its relationship with Taiwan Semiconductor Manufacturing Co. (TSMC) to include wireless technology in addition to PC technology. It has contracted TSMC to build its WiMAX chips, the 4th-generation broadband mobile technology.


Sony Ericsson to merge ODM collaboration with Taiwanese

Sony Ericsson Mobile Communication International AB will upgrade its original international procurement department in Taiwan to an ODM center to further consolidate ODM cooperation with local suppliers. Sony Ericssion signed ODM agreements with Chi Mei Communication System Inc. and Compal Communication Inc. for that purpose. It has withdrawn all orders from its Singapore-headquartered Flextronics International to reduce production costs for entry-level mobile phone models.


Top Companies in Patent Applications and Approvals (Taiwan)

Hon Hai Precision Industry Co garnered the most patent application and approval for 4 consecutive year last 2006. The top three were the same as 2005: Hon Hai with 1,830 applications, Industrial Technology Research Institute (ITRI) with 873 and Inventec Electronics Corp with 819. For applications approved, Hon Hai had 898, ITRI had 583 and Inventec had 493. For foreign institutional organizations, Royal Philips Electronics NV topped in terms of patent applications and Sony with 401 patent approvals.


Tower partners with Forza Silicon for cellphone camera chips

Tower partners with Forza Silicon to produce cellphone's camera chips with high-quality pictures using ultra-small pixels. Forza Silicon designs custom CMOS image sensors with Tower's Advanced Photo Diode (APD) pixel IP and Fab2, 0.18-micron process technology.


Radiant Opto-Electronics to Build New Plant in Guangzhou

Radiant is planning to build a new plant in Guangzhou, China for production expansion and to boost its production capacity in its Nanjing plant this 2007.


ProMos to buid the most efficient 300mm fab

ProMos is planning to build the world's most efficient 300mm fab and the estimated total cost will reach US$30.3 M on installing latest computer-integration-management (CIM) system at the factories. ProMos partnered with Applied Materials Inc., Oracle Corp., and Hewlett-Packard (H-P) Co. for the management-upgrade project.


VIA to provide Chips for Loongson

VIA will supply the southbridge chip for the Loongson processor created by Chinese Academy of Sciences. The Loongson processor was the first CPU developed independently in China by the Chinese Academy of Sciences.


ZTE partnered with Siano Mobile Silicon Ltd.

ZTE signed a partnership agreement with Siano Mobile Silicon Ltd. to manufacture 3G DVB-H mobile phone capable of receiving video sequences and television programs. Brionvega or N7100, as it is called, has a 240 by 320 pixel color screen, 2-megapixel camera, 3.6-Mbit/s HSDPA modem and Siano’s quad-band, multi-standard mobile TV receiver. N7100 was launched last Feb. 12 to Feb. 16 at the 3GSM conference and exhibition in Barcelona.


ZTE partnered with Siano Mobile Silicon Ltd.

ZTE signed a partnership agreement with Siano Mobile Silicon Ltd. to manufacture 3G DVB-H mobile phone capable of receiving video sequences and television programs. Brionvega or N7100, as it is called, has a 240 by 320 pixel color screen, 2-megapixel camera, 3.6-Mbit/s HSDPA modem and Siano’s quad-band, multi-standard mobile TV receiver. N7100 was launched last Feb. 12 to Feb. 16 at the 3GSM conference and exhibition in Barcelona.


CeBit 2008 could be a NoBit

Many companies and exhibitors are thinking of withdrawing their attendance at CeBit 2008 due to terrible result of this year’s trade show. This year, only 602 Taiwan vendors actually attended the trade show, down from 711 last 2006. Among those who did not attend were Shuttle, Acer and HTC, while Intel and Nvidia also scaled back their presences. Asus and Gigabyte are thinking of not attending next year’s show.


Microsoft and Fuji Xerox signed a patent agreement

Microsoft signed an agreement with Fuji Xerox giving the Redmond software maker right to use its patents relating to document management systems. With the agreement, Fuji Xerox can also have access to Microsoft’s patents relating to software and computer hardware innovations.


Infra-Com and STMicroelectronics cooperate

Infra-Com and STMicroelectronics have jointly created a complete reference design for a high-bit-rate wireless audio solution for consumer electronic products such as home entertainment systems, surround-sound and gaming speakers, DTV speakers, portable music and aftermarket accessories.


Techtium has developed BackuPower

Techtium has developed a power solution device that will enable handset users to use AAA batteries for their cellular phones as back up power. Royal Philips engages Techtium's technology for the incorporation of BackuPower to its Philips' Xenium NRG mobile phones.


Metalink, Samsung, and STM to launch a set-top box

Metalink, Samsung and STMicroelectronics are jointly introducing a set-top box (HD IPTV converter) that supports HDTV based on 802.11n wireless IPTV standard. Metalink will provide the 802.11n WLAN Plus chipset, Samsung and STM will provide teh HD video decoding technology.


Ericsson's TV moves

Ericsson has placed a bid to buy Norway's Tandberg Television ASA for 9.8 billion kronor (US$1.6B) in cash. The deal would allow Ericsson to prepare itself for TV over the internet technology.


Nothing new here: BenQ's German Folly

BenQ's bankrupt German handset division (i.e. Siemens handset division) will be split up and sold, following the company's inability to find a single buyer for the entire company. Worked out well for Siemens: it earned money on the sale to BenQ, plus avoided being the party responsible for closing its Germany manufacturing sites and firing 3,000 employees.


BRING ON THE ORDERS

Walton Advanced Engineering gets orders from Elpida and Qimonda

Elpida Memory and Qimonda placed DDR2 packaging and testing orders from Walton Advanced Engineering.


JPL contracted Tower for CMOS processors

Tower Semiconductor will manufacture a CMOS image sensor for Jet Propulsion Laboratory to be used in the dev't of its MultiSpectral Polarimetric Imager (MSPI). CAL-Tech manages JPL for NASA.


INTELLECTUAL PROPERTY DISPUTES

Infringement settlements between LG and other companies

In 2000 and 2001, LG Electronics had filed patent infringment case against FIC and Compal regarding the selling of computers with peripheral component interconnection without its permission. FIC and Compal agreed to settle this dispute with LG after a ruling in favor with LG was releases by the US Court. FIC and Compal will pay an unspecified royalties to LG.


Toshiba files a complaint against Daewoo

Toshiba filed a complaint in the US Int'l Trade Commission for patent infringement against Daewoo's US subsidiary and 16 other companies relating to DVD players and recorders.


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