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THT Guide -GPS products Segment: 
This business intelligence report from THT Research provides detailed contract manufacturing profiles of  22 OEM/ODM/EMS companies in the GPS products sector.
Profiles include data on company customer relationships, manufacturing capabilities, financials, shipment data and more. Profiles are generated from THT's online Contract Manufacturing Database, a collection of hundreds of company profiles that is updated on a weekly basis.
CONTENTS: This report contains the following data fields on GPS products makers. The number next to each category name indicates the total number of database entries on each subject included in this report. Click here to view a sample Contract Manufacturing Profile.

Total No. of Companies: 22
Total Contract Mfg. Deals: 291
Total Investments: 96
Total China Activities: 14
Total Shipments:247
Total Distributors: 2
Total Financial Reviews: 94
Total Gross Profit Margins: 7
Total Products: 433
Total Company's Own Brand Names: 8
Total Financial Notes: 24
Total General Notes: 77
Total Popularity Ranks:
Total Names Brand Company Makes: 124
Total Affiliations: 59
Total Factories:

Total Segment Price : $2480

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Lingo
ASIC - Application-specific integrated circuit
ASP - Average selling price
B - Billion
BB - Barebone
CAGR - Compounded annual growth rate
CDMA - Code division multiple access
CF - Color filter
COE - Central office equipment
CPE - Customer premise equipment
DAS - Direct-attached storage
DECT - Digital enhanced cordless telecommunications
DSC - Digital still camera
DSL - Digital subscriber line
DSLAMs - Digital subscriber line access multiplexers
DVRs - Digital video recorders
FPD - Flat-panel displays
GPRS - (General packet radio service) mobile phone handsets
GPS - Global Positioning System
IC - Integrated circuit
LCOS - Liquid crystal on silicon
LNB - Low noise block converter
LOM - LAN on motherboard
LTPS - Low-temperature poly-silicon
M - Millions
MB - Motherboards
MFG - Manufacturer
MFP - Multi-functional peripherals
MCU - Micro-controller units
MLCC - Mmulti-layer ceramic capacitor
MS - Multi-switches
MSOs - Multiple system operators
NB - Notebook computers
OBM - Own brand manufacturing
OEM/ODM - Contract manufacturing for others
OLEDs - Organic light-emitting diodes
PAS - Personal access system
PBGA - Plastic ball-grid array
PCB - Printed circuit board
PCI - Peripheral component Interface
PDA - Personal digital assistant
PDP - Plasma display panel
PLD - Programmable logic device
PS2 - PlayStation2
SIP - System in package technology
SMT - Surface mount technology
SoC - Silicon on chip or system on chip
STB - Set-top boxes
STN - Super-twisted nematic (LCD module)
TSOP - Tiny small outline packaging
VGA - Video graphics adapter
WLAN - Wireless LAN

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